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IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT: A PUBLICATION OF THE IEEE INSTRUMENTATION AND MEASUREMENT SOCIETY, VOL.55, NO.2, APRIL 2006

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-Second Special Section of the IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT in the Area of VLSI Testing-Future of Semiconductor Test-S. R. Das and R. Rajsuman, pp. 378
-A New Low-Cost RF Built-In Self-Test Measurement for System-on-Chip Transceivers-J.-Y Ryu, B. C. Kim, and I. Sylla, 381
-Embedded Test Resource for SoC to Reduce Required Tester Channels Based on Advanced -Convolutional Codes-Y. Han, X Li, H. Li, and A. Chandra, pp. 389
- Nondestructive Analysis of Interconnection in Two-Die BGA Using TDR-.M.-K. Chen, C-C. Tai, and Y.-J Huang, pp. 400
-Reversible-Logic Design With Online Testability-D. P Vasudevan, P .K. Lala, J. Di, and J. P. Parkerson, pp. 406
-Architectural Design of a Sensory Node Controller for Optimized Energy Utilization in Sensor Networks-R. X. Gao and Z. Fan, pp. 415
-Experimental Demonstration of a Compact and High-Performance Laser-Pumped Rubidium Gas Cell Atomic Frequency Standard-C. Affolderbach, F Droz, and G. Mileti, pp. 429
-Handheld-Impedance-Measurement System With Seven-Decade Capability and Potentiostatic Function-E. Angelini, A. Carullo, S. Corbellini, F Ferraris, V. Gallone, S. Grassini, M. Parvis, and A. Vallan, pp. 436
-A Measurement Method Based on Kalman Filtering for Ultrasonic Time-of-Flight Estimation-L. Angrisani, A. Baccigalupi, and R. Schiano Lo Moriello, pp. 442
-Passive Measurement Tool for Monitoring Mobile Packet Network Performances-L. Benetazzo, C. Narduzzi, P A. Pegoraro, and R. Tittoto, pp. 449
-Spaceborne Particle Detection-W. J. Burger, pp. 456
-Microwave Characterization and Modeling of Packaged HEMTS by a Direct Extraction Procedure Down to 30K- W. J. Burger, G. Crupi, and N. Donato, pp. 465
-Metrological Management of Large-Scale Measuring Systems-A. Carullo, pp.
471

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Ketersediaan

Informasi Detail

Judul Seri

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No. Panggil

REF 620 TIM i

Penerbit

USA : THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS,Inc.., 2006

Deskripsi Fisik

378-688 hlm, ill; 30cm

Bahasa

English

ISBN/ISSN

0018-9456

Klasifikasi

620

Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

VOL.55, NO.2, APRIL 2006

Subjek

VLSI Testing-Future of Semiconductor Test
New Low-Cost RF Built-In Self-Test Measurement
Embedded Test Resource
Reduce Required Tester Channels
Nondestructive Analysis of Interconnection in Two-
Reversible-Logic Design
Online Testability
Architectural Design
Sensory Node Controller
Experimental Demonstration of a Compact and High-P
Handheld-Impedance-Measurement System
A Measurement Method
Passive Measurement Tool
Spaceborne Particle Detection
Metrological Management of Large-Scale Measuring S

Info Detail Spesifik

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Pernyataan Tanggungjawab

THE IEEE INSTRUMENTATION AND MEASUREMENT SOCIETY

Versi lain/terkait

Lampiran Berkas

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