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IEEE Transactions On Instrumentation And Measurement: A Publication Of The Ieee Instrumentation And Measurement Society, Vol.54, No.5, October 2005

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-First Special Section of the IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT in the Area of VLSI Testing-Future of Semiconductor Test-S. R. Das and R. Rajsuman, pp. 1559
-Revisiting Response Compaction in Space for Full-Scan Circuits With Nonexhaustive Test Sets Using Concept of Sequence characterization-S. R. Das, C. V Ramamoorthy, M. H. Assaf E. M. Petriu, W-B. Jone, and M. Sahinoglu, pp. 1662
-Architecture and Design of an Open ATE to Incubate the Development of Third-Party Instruments-R. Rajsuman, N. Masuda, and K. Yamashita, pp. 1678
-A Translinear RMS Detector for Embedded Test Of RF ICs- Q. Yin, W. R. Eisenstadt, R. M. Fox, and T. Zhang, pp. 1708
-Embedded Loopback Test for RF ICs- J.-S. Yoon and W. R. Eisenstadt, pp. 1715
-A Built-In Self-Testing Method for Embedded Multiport Memory Arrays- V. Narayanan, S. Ghosh, W-B. Jone, and S. R. Das, pp. 1721
-A Dual-Mode Built-in Self-Test Technique for Capacitive MEMS Devices- X. Xiong, Y-L. Wu, and W.-B. Jone, pp. 1739
-A Methodology to Perform Online Self-Testing for Field-Programmable Analog Array Circuits-A. Laknaur and H. Wang, pp. 1751
-Evaluation, Analysis, and Enhancement of Error Resilience for Reliable Compression of VLSI Test Data-H. Hashempour, L. Schiano, and F. Lombardi, pp. 1761
-Analysis and Evaluation of Multisite Testing for VLSI- H. Hashempour, F. J. Meyer, and F. Lombardi, pp. 1770
-Novel On-Chip Circuit for Jitter Testing in High-Speed PLLS- J. M. Cazeaux, M. Omaña, and C. Metra, pp. 1779
-RBD Tools Using Compression, Decompression, Hybrid Techniques to Code, Decode, and Compute Reliability in Simple and Complex Embedded Systems- M. Sahinoglu and C. V. Ramamoorthy, pp. 1789
-Crosstalk Bounded Uncorrelated Jitter (BUJ) for High-Speed Interconnects-A. Kuo, R. Rosales, T. Farahmand, S. Tabatabaei, and A. Ivanov, pp.1800

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Ketersediaan

Informasi Detail

Judul Seri

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No. Panggil

REF 620 TIM i c.1

Penerbit

USA : IEEE., 2005

Deskripsi Fisik

pp. 1659-2129, ill; 30cm

Bahasa

English

ISBN/ISSN

0018-9359

Klasifikasi

620

Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

Vol.54, No.5, October 2005

Subjek

Built-In Self-Test
Testing-Future
Semiconductor Test
Full-Scan Circuits
Sequence characterization
Open ATE
Third-Party Instruments
Loopback Test
Multiport Memory Arrays
Online Self-Testing
Field-Programmable
Error Resilience
Reliable Compression
Multisite Testing
Jitter Testing
RBD Tools Using Compression
Decompression
Crosstalk Bounded

Info Detail Spesifik

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Pernyataan Tanggungjawab

A Publication Of The Ieee Instrumentation And Measurement Society

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